BGA Reballing

Real Chip offers BGA Reballing Services with speed, reliability and affordability, utilizes industry-wide proven processes for the reballing of Ball Grid Array (BGA) components to insure compliance with IPC/EIA J-STD-032 standards for use in hi-reliability applications.

We use The most advanced Reballing equipment in the industry

Pb-Free to Sn/Pb Conversion

Sn/Pb to Pb-Free Conversion

Strict adherence to IPC/EIA J-STD-032 quality standards

100% post process inspection includes visual inspection

Components processed in a ESD protected and climate controlled environment.

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