Moister Bake & Dry Pack

Sensitive electronic Devices packaged in moisture-permeable materials to the effects of moisture ingress when exposed to elevated temperatures.

Real Chip offers bake in vacum processes to remove the moisture from these vulnerable devices.

To maintain the dry condition of the Devices after baking the Devices are sealed under vacuum in a Moisture Barrier Bag (MBB).

A Desiccant bag and Humidity Indicator Card (HIC) are placed in the MBB before sealing to maintain and indicate the condition of the product.

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