Real Chip offers BGA Reballing Services with speed, reliability and affordability, utilizes industry-wide proven processes for the reballing of Ball Grid Array (BGA) components to insure compliance with IPC/EIA J-STD-032 standards for use in hi-reliability applications.
We use The most advanced Reballing equipment in the industry
Pb-Free to Sn/Pb Conversion
Sn/Pb to Pb-Free Conversion
Strict adherence to IPC/EIA J-STD-032 quality standards
100% post process inspection includes visual inspection
Components processed in a ESD protected and climate controlled environment.