•IPC/ECA J-STD-001, J-STD-002, J-STD-003; MIL-STD-202, Method 208; MIL-STD 883, Method 2003.10; IPC-TM-650, Method 2.4.12
•Solderability test provides optional conditions for preconditioning and soldering for the purpose of assessing the solderability of device package terminations. It provides procedures for dip & look solderability testing of through hole, axial and surface mount devices and a surface mount process simulation test for surface mount packages.
•Solderability testing provides a means of determining the solderability of device package terminations that are intended to be joined to another surface using SnPb or Pb-free solder. The procedure, considered to be destructive, will test whether the packaging materials and processes used during the manufacturing operations produce a component that can be successfully soldered in the next level assembly.